JPH084696Y2 - 混成集積回路 - Google Patents
混成集積回路Info
- Publication number
- JPH084696Y2 JPH084696Y2 JP1990073112U JP7311290U JPH084696Y2 JP H084696 Y2 JPH084696 Y2 JP H084696Y2 JP 1990073112 U JP1990073112 U JP 1990073112U JP 7311290 U JP7311290 U JP 7311290U JP H084696 Y2 JPH084696 Y2 JP H084696Y2
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- hybrid integrated
- integrated circuit
- connection
- external lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004593 Epoxy Substances 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 238000003780 insertion Methods 0.000 description 3
- 230000037431 insertion Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000004806 packaging method and process Methods 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- -1 etc. Substances 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Landscapes
- Multi-Conductor Connections (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1990073112U JPH084696Y2 (ja) | 1990-07-09 | 1990-07-09 | 混成集積回路 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1990073112U JPH084696Y2 (ja) | 1990-07-09 | 1990-07-09 | 混成集積回路 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0431269U JPH0431269U (en]) | 1992-03-13 |
JPH084696Y2 true JPH084696Y2 (ja) | 1996-02-07 |
Family
ID=31611654
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1990073112U Expired - Lifetime JPH084696Y2 (ja) | 1990-07-09 | 1990-07-09 | 混成集積回路 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH084696Y2 (en]) |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61151282U (en]) * | 1985-03-12 | 1986-09-18 | ||
JPS63101470U (en]) * | 1986-12-22 | 1988-07-01 | ||
JPH062225Y2 (ja) * | 1987-09-09 | 1994-01-19 | 株式会社村田製作所 | 表面実装型コネクタ |
JPH0624136Y2 (ja) * | 1988-05-20 | 1994-06-22 | 松下電器産業株式会社 | 接続端子 |
-
1990
- 1990-07-09 JP JP1990073112U patent/JPH084696Y2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPH0431269U (en]) | 1992-03-13 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
EXPY | Cancellation because of completion of term |